It is the package form that directly binds the chip on the PCB board. The optoelectronic chip is directly bonded to the circuit board with silver-containing epoxy resin glue, and the circuit is connected by wire bonding, and finally is sealed with epoxy resin glue or silane resin (Silicone) top drip glue.
The benefit of this non-hermetic packaging process is that automation can be used. The application of COB technology in the field of optical communication also enables optical modules to achieve the advantages of automated large-scale manufacturing at the packaging level.
At present, COB technology is widely used in short-distance communication module products using VCSEL arrays, and highly integrated silicon photonics products are also packaged with COB technology.
